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Model 9825
 | ESI's Model 9825 Laser Processing System is the latest generation system based on ESI’s successful 9800 platform. The 9825 is designed to meet the needs of high volume 300 mm wafer processing of DRAM, SRAM, embedded memory and other laser fuse applications. The requirements of new generations of highspeed chips are driving the industry towards tighter link pitches and new fuse materials. The 9825 offers the smallest spot size available for the processing of advanced memory devices.
For more information on this product contact Ian Guiney at guineyi@esi.com.
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