|
|
> > > >
Cignis
 | Cignis provides fully automated scribing and full-cut dicing of silicon wafers of up to 400 microns in thickness. The system is optimized for wafers that are 100 microns or less. Cignis features one of the most powerful picosecond lasers available on the market, to provide true cold ablation, with minimal heat-affected zone (HAZ), debris, and industry-leading throughput. The tool can be easily integrated into existing production lines. The application of high-powered, "Ultrafast" lasers, coupled with ESI's patented, world-class beam positioning approach delivers superior performance.
For more information please contact Martin Igarashi at igarashim@esi.com |
|