Overview

ESI’s laser singulation solutions provide fully automated scribing and full cut dicing of ultra-thin Silicon Wafers. The systems feature some of the world’s most powerful lasers to provide true ablation, with minimal HAZ (Heat Affected Zone), “cold” debris, and industry-leading throughput. Cignis is easily integrated into existing production lines. The application of high-powered lasers coupled with ESI’s patented, world-class beam positioning approach, delivers nothing short of one-of-a-kind performance.